Skip to main content

Version 1 - JUN/2015

Technical Specification
GradeBasis Wt.
Gr/m2
Thickness
Microns
Ply-Bond
Ft.lb - J/m2
Ring Crush
Kgf
Bursting
Kpa
Chip board 230 - 525 325 - 750 120 - 252 45 - 85 400 - 650
Super chip board 230 - 525 325 - 750170 - 357 47 - 87 450 - 700
Core board B 230 - 525 325 - 750200 - 420 50 - 100 475 - 750
Core board B+ 230 - 525 325 - 750225 - 473 52 - 102 500 - 800
Core board A30 260 - 525 340 - 700250 - 525 65 - 120 525 - 850
Core board A31 260 - 525 340 - 700300 - 63070 - 125 550 - 925
Core board A32 260 - 525 340 - 700350 - 735 80 - 135575 - 950
Core board A42 260 - 500340 - 650 405 - 850 85 - 140 600 - 975
Core board A51 260 - 500 340 - 650 475 - 1000 90 - 145 625 - 1000
PTK - 1 350 - 450470 - 630 125 - 263 75 - 115 575 - 700
PTK - 2 350 - 450470 - 630 150 - 315 80 - 120625 - 800
PTK - 3 350 - 450470 - 630 200 - 420 100 - 130 725 - 850
PTK - 3 350 - 450470 - 630 225 - 473 125 - 160775 - 900
PTK - 4350 - 450470 - 630 275 - 578 130 - 170 800 - 950
PTK - 5350 - 450470 - 630 325 - 683 135 - 175 850 - 1000
Cobb 60 sec. to customer request

 

Specification and Packaging
Moisture7 +/- 1%
Basis Wt.+/- 4% Roll Diameter (1,000 -1,500) mm
Thickness+/- 4% Minimum Trim Accepted 2,200 mm
Ply-bond +/- 10% Min. Coil Width90 mm
Packaging wrappedPalletized, Strapped and Film

Packaging: Palletized, Strapped and film Wrapped