Version 1 - JUN/2015
| Technical Specification | |||||
|---|---|---|---|---|---|
| Grade | Basis Wt. Gr/m2 | Thickness Microns | Ply-Bond Ft.lb - J/m2 | Ring Crush Kgf | Bursting Kpa |
| Chip board | 230 - 525 | 325 - 750 | 120 - 252 | 45 - 85 | 400 - 650 |
| Super chip board | 230 - 525 | 325 - 750 | 170 - 357 | 47 - 87 | 450 - 700 |
| Core board B | 230 - 525 | 325 - 750 | 200 - 420 | 50 - 100 | 475 - 750 |
| Core board B+ | 230 - 525 | 325 - 750 | 225 - 473 | 52 - 102 | 500 - 800 |
| Core board A30 | 260 - 525 | 340 - 700 | 250 - 525 | 65 - 120 | 525 - 850 |
| Core board A31 | 260 - 525 | 340 - 700 | 300 - 630 | 70 - 125 | 550 - 925 |
| Core board A32 | 260 - 525 | 340 - 700 | 350 - 735 | 80 - 135 | 575 - 950 |
| Core board A42 | 260 - 500 | 340 - 650 | 405 - 850 | 85 - 140 | 600 - 975 |
| Core board A51 | 260 - 500 | 340 - 650 | 475 - 1000 | 90 - 145 | 625 - 1000 |
| PTK - 1 | 350 - 450 | 470 - 630 | 125 - 263 | 75 - 115 | 575 - 700 |
| PTK - 2 | 350 - 450 | 470 - 630 | 150 - 315 | 80 - 120 | 625 - 800 |
| PTK - 3 | 350 - 450 | 470 - 630 | 200 - 420 | 100 - 130 | 725 - 850 |
| PTK - 3 | 350 - 450 | 470 - 630 | 225 - 473 | 125 - 160 | 775 - 900 |
| PTK - 4 | 350 - 450 | 470 - 630 | 275 - 578 | 130 - 170 | 800 - 950 |
| PTK - 5 | 350 - 450 | 470 - 630 | 325 - 683 | 135 - 175 | 850 - 1000 |
Cobb 60 sec. to customer request |
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| Specification and Packaging | |||
|---|---|---|---|
| Moisture | 7 +/- 1% | ||
| Basis Wt. | +/- 4% | Roll Diameter | (1,000 -1,500) mm |
| Thickness | +/- 4% | Minimum Trim Accepted | 2,200 mm |
| Ply-bond | +/- 10% | Min. Coil Width | 90 mm |
| Packaging wrapped | Palletized, Strapped and Film | ||
Packaging: Palletized, Strapped and film Wrapped