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Version 1 – JUN/2015

Technical Specification
GradeBasis Wt.
Gr/m2
Thickness
Microns
Ply-Bond
Ft.lb - J/m2
Ring Crush
Kgf
Bursting
Kpa
Chip board 230 - 525325 - 750120 - 25245 - 85400 - 650
Super chip board 230 - 525325 - 750170 - 35747 - 87450 - 700
Core board B 230 - 525325 - 750200 - 42050 - 100475 - 750
Core board B+ 230 - 525325 - 750225 - 47352 - 102500 - 800
Core board A30 260 - 525340 - 700250 - 52565 - 120525 - 850
Core board A31 260 - 525340 - 700300 - 63070 - 125550 - 925
Core board A32 260 - 525340 - 700350 - 73580 - 135575 - 950
Core board A42 260 - 500340 - 650405 - 85085 - 140600 - 975
Core board A51 260 - 500340 - 650475 - 100090 - 145625 - 1000
PTK - 1 350 - 450470 - 630125 - 26375 - 115575 - 700
PTK - 2 350 - 450470 - 630150 - 31580 - 120625 - 800
PTK - 3 350 - 450470 - 630200 - 420100 - 130725 - 850
PTK - 3 350 - 450470 - 630225 - 473125 - 160775 - 900
PTK - 4350 - 450470 - 630275 - 578130 - 170800 - 950
PTK - 5350 - 450470 - 630325 - 683135 - 175850 - 1000
Cobb 60 sec. to customer request

 

Specification and Packaging
Moisture7 +/- 1%
Basis Wt.+/- 4%Roll Diameter(1,000 -1,500) mm
Thickness+/- 4%Minimum Trim Accepted 2,200 mm
Ply-bond +/- 10%Min. Coil Width90 mm
Packaging wrappedPalletized, Strapped and Film

Packaging: Palletized, Strapped and film Wrapped